packaging

According to Taiwanese media reports, Intel's next-generation advanced packaging technology EMIB-T is facing severe yield challenges. ABF substrate supplier Unimicron stated during its earnings call on July 29 that the technology is "not yet mature," and the yield target for three EMIB-T substrate suppliers (Unimicron, Ibiden, and Shinkawa) during the initial mass production phase at the end of 2027 is only 50%.EMIB-T is Intel's advanced packaging solution that competes with TSMC's CoWoS-L, differing in that it embeds the silicon bridge directly into the substrate rather than using a silicon interposer, making substrate suppliers a key factor in determining success or failure. Google's ninth-generation TPU has confirmed that it will adopt EMIB-T packaging when it goes into mass production in 2028, with MediaTek responsible for chip co-design. If the chip successfully goes into mass production, its shipment volume is expected to challenge NVIDIA. Unimicron stated that the customer (Intel) has provided a profit guarantee mechanism, ensuring that suppliers can remain profitable even if yields are poor, and that profit margins will exceed the company's average level after achieving the 50% yield target. Currently, there is still considerable uncertainty about whether EMIB-T can achieve its mass production target by the end of 2027.

According to the Electronic Times, TSMC plans to further expand the outsourcing scale of the CoW (Chip-on-Wafer) segment in its CoWoS advanced packaging, entrusting more packaging orders to ASE and other OSAT manufacturers. CoWoS is TSMC's 2.5D packaging technology that connects AI processors such as GPUs with HBM through an intermediary layer, where CoW is the step of combining the chip with the intermediary layer, and WoS is the step of packaging the substrate. Previously, TSMC mainly outsourced the WoS segment, with only a small portion of CoW being entrusted.This move aims to alleviate the packaging capacity bottleneck caused by the continuous surge in demand for AI chips. TSMC holds about 90% of the global AI chip manufacturing market, but as the demand for self-developed chips from manufacturers like Nvidia and AI data centers skyrockets, capacity has become difficult to meet. Industry insiders expect OSATs to significantly increase equipment investment, especially in post-process areas such as wafer cutting and bonding. Several laser processing and bonding equipment suppliers in South Korea have been confirmed to be negotiating with OSATs regarding the supply of CoW equipment.

According to SolanaFloor, Solana's "Resource and Inclusion Fee" proposal SGP-0003 has entered the support stage. If it receives 15% active staking support, the proposal will proceed to a full governance vote.If implemented, the daily SOL burn amount is expected to increase from the current 650 coins (approximately $51,000) to a maximum of 9,000 coins (approximately $702,000).

According to The Information, TSMC (TSM.N) will develop AI chip packaging technology.In the past, packaging has been regarded as a relatively conventional process in semiconductor manufacturing, but with the surge in AI demand, chip design companies need to integrate more processors and high-bandwidth memory into increasingly large and complex packages. Advanced packaging has become one of the industry's most critical bottlenecks. Intel has developed a packaging technology called Embedded Multi-Die Interconnect Bridge (EMIB).This technology uses small silicon bridges to establish high-speed connections between processors and memory, enabling support for larger-scale multi-chip designs, thus creating more powerful AI chips and helping chip designers achieve supply chain diversification, which has attracted the attention of potential customers such as NVIDIA (NVDA.O).Insiders say that within TSMC, engineers refer to this advanced packaging project as "EMIB-like" and have discussed this solution with some customers.

Domestic DRAM storage IDM leader Changxin Technology will officially list on the Sci-Tech Innovation Board on July 27, with an issuance valuation of approximately 580 billion yuan and a total fundraising amount of 29.5 billion yuan, of which about 22.066 billion yuan is for equipment purchase and installation costs. Industry insiders believe that 2026-2027 is the golden window period for the introduction of domestic equipment.In terms of the supply chain, on the equipment side, North Huachuang has shipped a large volume of various categories such as etching and thin film deposition, Zhongwei Company continues to validate and mass-produce etching and thin film equipment, Huahai Qingshi CMP equipment has entered the core supply chain, and Jingce Electronics and Jingzhida testing equipment are benefiting simultaneously. On the materials side, Yake Technology precursor products cover advanced process needs, Guanggang Gas provides special gases and bulk gases, Jinhong Gas has a gas production order cycle of 15 years, Tongcheng New Materials ArF/KrF photoresists have entered mass production, Jingrui Electric Materials has a market share of over 40% in high-purity hydrogen peroxide, but high-end photoresists are still in the validation stage, and Debang Technology is in the sample testing stage. On the packaging and module side, Huatian Technology is a packaging supplier, Jiangbolong and Demingli have reached procurement agreements, while Maijie Technology is still in the introduction phase. On the distribution side, Shangluo Electronics has been authorized, and there are expectations for supply strategy adjustments after listing. Several listed companies hold shares indirectly through industrial funds, with Shangfeng Cement holding approximately 0.1517% of the equity before issuance.

The CEO of Mysten Labs, evan.sui, stated in a recent interview that he does not agree with the notion of "bear markets are great, keep building." In fact, bear markets are not "great" and are not worth celebrating or boasting about. The volatility does not merely "cleanse the market," but can scare away builders and users, leading to a smaller talent pool and slower adoption processes. While bear markets may allow a few teams to focus more, packaging it as beneficial for everyone overlooks the real costs and can harm the long-term development of the crypto industry. During downturns, many people lose their savings, cash flow breaks down, and even some strong teams may not be able to survive, which genuinely harms many individuals.

According to the Securities Times, Douyin released the "Douyin Community Financial Industry Convention (Trial)," which mentions, "It is prohibited to package and publish illegal financial content related to virtual currency exchange business, providing information intermediary and pricing services for virtual currency transactions under the concepts of blockchain, digital assets, etc.; it is prohibited to analyze or predict individual stock buying and selling prices, promote future trends, provide investment consulting advice, and other illegal stock recommendation behaviors in the name of popular science."

ChainCatcher news, according to The Block, CKpool developers revealed that the miner who packaged block height 899,826 early this morning is an independent miner using a hash power rental strategy. This miner temporarily increased their hash power from 6.11 PH/s to 261 PH/s through CKpool's solo mining software, ultimately successfully mining the block with a probability of about 1/3050 (when the total network hash power was 796 EH/s), earning a reward of 3.151 BTC (approximately $330,000).It is worth noting that this is the 300th block mined by an independent miner in CKpool's history. A similar case occurred in April this year, demonstrating the potential for small and medium miners to participate in Bitcoin mining through flexible strategies.

ChainCatcher News, U.S. Department of Commerce: The Biden-Harris administration launches a competition for up to $1.6 billion in funding to accelerate the development of advanced semiconductor packaging technology in the United States.

ChainCatcher news, the currency market of the Sui ecosystem, Scallop, announced that Scallop sCoins have now been wrapped and can be viewed in the Sui wallet. Scallopers will be able to migrate directly from the old version of sCoins to the newer Wrapped sCoins through the Scallop dApp.It is reported that sCoins are Scallop's liquidity derivative tokens.

ChainCatcher news, according to a report by Financial界, the National Intellectual Property Administration announced that Tencent Technology (Shenzhen) Co., Ltd. has applied for a patent named "Blockchain Transaction Packaging Method, Device, Equipment, Storage Medium and Program Product," with publication number CN117609361A, and the application date is October 2023.

Chain Catcher News, the blockchain game project MosaicFantasy has announced the completion of its game demo packaging. NFT holders can enjoy a whitelist for the closed beta test, and early participants in the closed beta will receive additional airdrop rewards. The product will launch the NFT secondary market simultaneously when the official character NFTs are released, allowing past blind boxes to be freely traded on the secondary market.At the same time, MosaicFantasy will soon launch the first phase of the NFT blind box preheating event, with the blind boxes containing 6-star character cards that can participate in the game and offer random LKK token rewards, with an initial release of 2000 blind boxes. Additionally, the project has announced that the LKK token will be listed on the IDO platform in mid-October.