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LINK $11.51 +1.00%
HYPE $80.70 -2.14%
AAVE $123.97 -3.12%
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XLM $0.1811 -1.28%
ZEC $774.71 -2.06%

m6

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first_img Apple M6 uses TSMC 2 nanometers, advanced packaging demand drives the Taiwan supply chain

Apple's first 2-nanometer M6 chip officially debuts, equipped with a 12-core CPU, 12-core GPU, and dual 16-core neural network engines, with unified memory bandwidth reaching up to 170GB per second, initially featured in the new Mac mini. This chip is manufactured by TSMC using a 2-nanometer process and is the first to adopt gate-all-around (GAA) nanosheet transistors, making it the world's first consumer-grade 2-nanometer chip.The supply chain is focused on the subsequent high-end M series packaging architecture. Based on the Fusion Architecture of the previous generation M5 Pro, M5 Max, and the four-die design of M5 Ultra, Apple chips have transitioned from a single large die to a modular design. Future M6 Pro, Max, or Ultra are expected to enhance advanced packaging requirements such as SoIC-MH and WMCM, increasing interconnect density with SoIC-MH and integrating logic, LPDDR memory, and high-speed I/O with WMCM.TSMC is actively preparing for expansion, with Zhunan AP6 as the main mass production base for SoIC, Longtan AP3 upgrading to WMCM, and Chiayi AP7 taking on related capacity. Analysts estimate that WMCM's monthly production capacity will reach about 60,000 units by the end of 2026 and over 120,000 units in 2027. Equipment manufacturers such as Hongshuo, Junhua, Yinneng, and material manufacturers Changxing, Xinying Materials, and Yongguang are expected to benefit.
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