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hot_img The U.S. Department of Commerce invests $874 million in seven semiconductor companies, betting on seven underlying technologies for the post-GPU era

On July 29, the U.S. Department of Commerce signed letters of intent with seven companies, totaling up to $874 million, to support seven "post-GPU era" underlying technology routes such as CPO, ferroelectric memory, and 3D packaging in the form of equity investments. This marks a shift in the U.S. chip strategy from "capacity reshoring" to "technology route selection."The seven companies and their technology directions include: GlobalFoundries (CPO silicon photonic integration, $300 million), Kepler Computing (ferroelectric 3D memory, $245 million), Multibeam (multi-electron beam direct-write lithography and advanced packaging, $140 million), Extropic (thermodynamic sampling unit TSU, $75 million), Thintronics (ultra-low loss dielectric materials, $50 million), Aeluma (large-size phosphorus-free optoelectronic device substrates, $30 million), and OBSIDIA (hardware zero-trust chip anti-counterfeiting, $34 million). All companies are required to provide non-controlling minority equity to the U.S. government.This move shows that the funding usage of the CHIPS Act is shifting from subsidizing wafer fabs to directly holding equity in cutting-edge technology companies with national capital, in order to secure rule-making authority in the post-Moore era.

hot_img Silicon wafer supply tightens: 12-inch capacity is nearing full load, GlobalWafers signs a 10-year contract with Micron

According to the South Korean media The Elec, GlobalWafers stated during the Q2 earnings call that the production lines for 12-inch, 8-inch, and 6-inch wafers are nearing full capacity, with some advanced 12-inch products experiencing supply constraints due to a surge in demand for AI chips, HBM, and advanced packaging. Shin-Etsu Chemical achieved double-digit growth in 12-inch shipments both year-on-year and quarter-on-quarter in Q2, and Sungrow also believes that customer inventory adjustments are nearing completion. Although SK Siltron is gradually releasing capacity from new production lines, it is still difficult to meet the growth rate of orders.Tight supply is driving changes in long-term contract models, and GlobalWafers signed a 10-year LTA (including advance payment) with Micron last month. Prices in the non-LTA market have begun to rise and are expected to continue to increase in the second half of the year. GlobalWafers stated that it is negotiating with customers to incorporate price adjustment mechanisms into new contracts, and Nexchip also emphasized the need for "broad and meaningful price increases" to support reinvestment. Industry insiders expect that as new factories from Samsung, SK Hynix, and Micron come online, wafer demand will double in the second half of 2027, and supply shortages may further intensify.
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