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first_img The price of semiconductor silicon wafers has increased by about 10% for the first time in over three years, benefiting companies like GlobalWafers and other Taiwanese manufacturers

According to the Economic Daily, semiconductor silicon wafers have seen a significant price increase for the first time since the COVID-19 pandemic, covering the full range of specifications including 6-inch, 8-inch, and 12-inch, with an increase starting at 10%. Industry insiders believe this is the first price adjustment in over three years, and major Taiwanese silicon wafer suppliers such as GlobalWafers, TSMC, and Hejian are expected to see improvements in revenue and profitability.GlobalWafers stated that recent demand in some end markets has gradually improved, inventory adjustments in the supply chain are healthier than in the past, and market signals are more positive than last year, but prices still depend on the product, specifications, and customer situations. TSMC mentioned that under cost pressures and demand support, they have begun communicating price adjustments with customers, and operations in the second half of the year are expected to outperform the first half. Hejian indicated that they are actively negotiating price adjustments with customers and continuing to promote advanced packaging and related products.Industry analysis suggests that this round of price increases mainly reflects the rebound in chip demand driven by AI, with increased usage in advanced and mature processes, allowing the upstream silicon wafer industry to gradually feel the recovery. Currently, the negotiation progress varies among factories and customers, with some 12-inch polished wafers already subject to new quotes with double-digit percentage increases, and discussions for 8-inch and 6-inch products are also moving in a similar upward direction.

first_img Samsung's advanced foundry prices rise by up to 15%, driven by AI demand boosting capacity

According to Reuters, citing informed sources, Samsung Electronics has raised prices for some new advanced foundry service orders by up to 15%, due to a surge in demand for AI chips leading to tight capacity. The company has long lagged behind TSMC in the foundry sector. Demand from Chinese customers is particularly strong, but Samsung must prioritize serving U.S. customers and reserve some capacity to support its own chip production, making it unable to take on all orders. Affected by U.S. export restrictions on advanced chip equipment to China, Chinese companies are increasingly reliant on overseas foundries, with some Chinese customers accepting the maximum price increase.Informed sources stated that Samsung raised the prices for the 4nm (SF4) process in July, with price increases of 10% to 15% for Chinese and U.S. customers, and 5% to 10% for Taiwanese customers; the price for 5nm (SF5) wafers increased by 10% to 15%, nearly 10% higher than the older 8nm process. The SF4 production line at the Pyeongtaek factory has been operating at full capacity since the end of last year, producing logic chips for customers like Qualcomm and providing basic bare chips for Samsung's own HBM. Analysts point out that after TSMC's advanced capacity was fully booked, customers turned to Samsung and Intel, giving Samsung room to raise prices.Samsung's foundry business has been continuously losing money since 2022, but the company expects to quickly turn a profit driven by improved utilization rates, yield improvements, and rising prices. Foundry revenue in the second half of the year is expected to grow by double digits year-on-year, with advanced processes accounting for more than half, and AI and high-performance computing applications accounting for over 30%. Companies like Tesla, Apple, Broadcom, and NVIDIA have already reached relevant cooperation agreements with Samsung, and Google is also in talks to use the SF4 process.

hot_img The U.S. Department of Commerce invests $874 million in seven semiconductor companies, betting on seven underlying technologies for the post-GPU era

On July 29, the U.S. Department of Commerce signed letters of intent with seven companies, totaling up to $874 million, to support seven "post-GPU era" underlying technology routes such as CPO, ferroelectric memory, and 3D packaging in the form of equity investments. This marks a shift in the U.S. chip strategy from "capacity reshoring" to "technology route selection."The seven companies and their technology directions include: GlobalFoundries (CPO silicon photonic integration, $300 million), Kepler Computing (ferroelectric 3D memory, $245 million), Multibeam (multi-electron beam direct-write lithography and advanced packaging, $140 million), Extropic (thermodynamic sampling unit TSU, $75 million), Thintronics (ultra-low loss dielectric materials, $50 million), Aeluma (large-size phosphorus-free optoelectronic device substrates, $30 million), and OBSIDIA (hardware zero-trust chip anti-counterfeiting, $34 million). All companies are required to provide non-controlling minority equity to the U.S. government.This move shows that the funding usage of the CHIPS Act is shifting from subsidizing wafer fabs to directly holding equity in cutting-edge technology companies with national capital, in order to secure rule-making authority in the post-Moore era.

Changxin Memory is considering building a second DRAM wafer factory in Beijing and is in talks for financing support

According to Reuters, informed sources say that Changxin Storage is considering building a second 12-inch DRAM wafer fab in Beijing's Yizhuang and is negotiating financing with the Beijing Economic and Technological Development Zone and several state-owned technology companies. The company is seeking at least 60 million yuan (approximately 8.9 million USD) in support, but negotiations are still in the early stages, and the scale and structure of the financing may be adjusted.The proposed factory will be located at the site of Changxin Storage's existing DRAM wafer fab in Beijing. The planned production capacity and total investment for the project have not yet been determined, while building a fab capable of producing advanced DRAM typically requires over 10 billion USD. Currently, Changxin Storage operates two 12-inch DRAM wafer fabs in Hefei and one in Beijing, each with a monthly production capacity of about 100,000 wafers. Changxin Storage is also building new factories in Shanghai and Hefei, and once the related projects are fully operational, the company's monthly production capacity could double to over 600,000 wafers.This expansion comes as demand for storage chips is driven by AI infrastructure, data centers, and consumer electronics entering an upward cycle. The company completed an 8.6 billion USD IPO last month, marking the largest fundraising for a semiconductor company listed in mainland China, and its stock price has risen by 13% since going public. Changxin Storage is currently the fourth largest DRAM manufacturer in the world, but Samsung Electronics, SK Hynix, and Micron together still account for nearly 90% of the global market share in the first quarter. Beijing and Shanghai are also providing funding and other support to Changxin Storage to gain economic and strategic benefits from its expansion.
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