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hot_img The U.S. Department of Commerce invests $874 million in seven semiconductor companies, betting on seven underlying technologies for the post-GPU era

On July 29, the U.S. Department of Commerce signed letters of intent with seven companies, totaling up to $874 million, to support seven "post-GPU era" underlying technology routes such as CPO, ferroelectric memory, and 3D packaging in the form of equity investments. This marks a shift in the U.S. chip strategy from "capacity reshoring" to "technology route selection."The seven companies and their technology directions include: GlobalFoundries (CPO silicon photonic integration, $300 million), Kepler Computing (ferroelectric 3D memory, $245 million), Multibeam (multi-electron beam direct-write lithography and advanced packaging, $140 million), Extropic (thermodynamic sampling unit TSU, $75 million), Thintronics (ultra-low loss dielectric materials, $50 million), Aeluma (large-size phosphorus-free optoelectronic device substrates, $30 million), and OBSIDIA (hardware zero-trust chip anti-counterfeiting, $34 million). All companies are required to provide non-controlling minority equity to the U.S. government.This move shows that the funding usage of the CHIPS Act is shifting from subsidizing wafer fabs to directly holding equity in cutting-edge technology companies with national capital, in order to secure rule-making authority in the post-Moore era.

Changxin Memory is considering building a second DRAM wafer factory in Beijing and is in talks for financing support

According to Reuters, informed sources say that Changxin Storage is considering building a second 12-inch DRAM wafer fab in Beijing's Yizhuang and is negotiating financing with the Beijing Economic and Technological Development Zone and several state-owned technology companies. The company is seeking at least 60 million yuan (approximately 8.9 million USD) in support, but negotiations are still in the early stages, and the scale and structure of the financing may be adjusted.The proposed factory will be located at the site of Changxin Storage's existing DRAM wafer fab in Beijing. The planned production capacity and total investment for the project have not yet been determined, while building a fab capable of producing advanced DRAM typically requires over 10 billion USD. Currently, Changxin Storage operates two 12-inch DRAM wafer fabs in Hefei and one in Beijing, each with a monthly production capacity of about 100,000 wafers. Changxin Storage is also building new factories in Shanghai and Hefei, and once the related projects are fully operational, the company's monthly production capacity could double to over 600,000 wafers.This expansion comes as demand for storage chips is driven by AI infrastructure, data centers, and consumer electronics entering an upward cycle. The company completed an 8.6 billion USD IPO last month, marking the largest fundraising for a semiconductor company listed in mainland China, and its stock price has risen by 13% since going public. Changxin Storage is currently the fourth largest DRAM manufacturer in the world, but Samsung Electronics, SK Hynix, and Micron together still account for nearly 90% of the global market share in the first quarter. Beijing and Shanghai are also providing funding and other support to Changxin Storage to gain economic and strategic benefits from its expansion.

hot_img Citrini Analyst: The progress of China's DUV is not surprising, the sell-off of semiconductor equipment stocks like ASML is excessive

Citrini analyst Jukan posted on social media that the news of China's progress in DUV lithography technology is not particularly surprising, as the market had already formed certain expectations. He pointed out that The Information's related report only cited a professor from a transportation university in China speaking at an internal meeting in June and did not disclose more substantial information. Jukan believes that the sell-off reaction seen in semiconductor equipment stocks like ASML is an overreaction to this news.According to previous reports, The Information cited sources saying that a state-owned enterprise supported by Chinese state capital has begun mass production of domestically developed DUV (Deep Ultraviolet) lithography manufacturing equipment, marking a key progress in the localization of China's semiconductor industry.Insiders stated that the enterprise plans to produce about 5 domestically made DUV lithography machines by 2026 and expand to about 20 machines by 2027. Although there is still a gap compared to the 131 immersion DUV lithography systems delivered by Dutch lithography giant ASML last year, the entry of domestic equipment into mass production is seen by the market as an important breakthrough in the localization of China's chip supply chain.
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