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Cosmos Hub: 1.227 million ATOM has been recovered from the Neutron attack case, with funds temporarily stored at a 4/6 multi-signature address

Cosmos Labs disclosed that on September 22, Neutron encountered a governance attack that led to the theft of liquidity from protocols such as Astroport, with approximately 1.73 million ATOM subsequently transferred by the attacker to Cosmos Hub. The Cosmos Hub itself was not attacked, and user funds were not affected. To prevent the stolen ATOM from being transferred out, Hub validators temporarily paused the network for about 24.5 hours and resumed block production on September 23 based on the patched Gaia v28.3.0.Cosmos Labs stated that during the pause, 1.227 million ATOM remained in the attacker's Hub address. When the network was restored, these were transferred to a 4/6 multi-signature address composed of Nansen, Keplr, Enigma, Silknodes, Kiln, and Polkachu through a one-time change. Previously, about 500,000 ATOM had been exchanged for ETH via THORChain and could not be recovered; another 169,000 ATOM entered the attacker's address after the network was restored due to THORChain refunds and were sold after being transferred to Osmosis. The current multi-signature address holds approximately 1.227 million ATOM, which can only be returned after authorization from a Cosmos Hub governance proposal. The related funds will not be staked, lent, or traded. The Neutron team expects to submit a recovery plan and related governance proposals next week.

first_img TSMC temporarily uses micro-bump packaging for HBM and requires the development of a 5μm solution

According to sources in the materials industry, on September 2, TSMC is expected to continue using traditional micro-bump technology rather than hybrid bonding in the short term for connecting high-bandwidth memory (HBM) with AI accelerators in advanced packaging. Considering the development cycle of related materials, finer pitch micro-bumps are expected to be used until the later stages of HBM4 and the early stages of HBM5. TSMC has requested its materials and equipment partners to develop bonding and underfill solutions for approximately 5-micron bumps, with suppliers from South Korea and Japan beginning development, and mass production of 5μm bumps expected to start in the second half of 2028.Currently, the bump height of the third-generation extended HBM, namely HBM3E, is about 15-25μm, while HBM4 is close to about 10μm. Japanese material suppliers have previously stated that it is difficult to guarantee quality below 15μm. The reduction and refinement of bumps are due to the height limitations of HBM cubes and the demand for higher interconnection density. JEDEC specifies that the maximum height for HBM stacks is 775μm. In TSMC's advanced CoWoS packaging, the HBM stacks assembled by GPU and memory suppliers are mounted onto the silicon interposer via micro-bumps, with the 16-layer DRAM chip stacks completed within HBM packaging by SK hynix and Samsung Electronics.The first and second generations of HBM used larger solder bumps, while micro-bumps became mainstream around the HBM3 generation. SK hynix uses the MR-MUF process, while Samsung Electronics uses TC-NCF. Hybrid bonding allows for thinner and denser interconnections through direct bonding of copper pads; TSMC has utilized this on its SoIC platform for logic chip stacking, but HBM still connects to the interposer using micro-bumps.
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