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hot_img SK Hynix will expand its NAND production capacity in Dalian by about 50%, with the second factory in Dalian expected to start production in the first half of next year

SK Hynix has restarted the construction of its second NAND flash memory factory in Dalian, expecting to increase the monthly production capacity in the region by about 50%. The new production line is designed for a monthly capacity of approximately 50,000 wafers, combined with the existing Dalian Plant 1's monthly capacity of 100,000 wafers, bringing SK Hynix's total NAND production capacity in China to about 150,000 wafers per month. The factory began construction four years ago but was paused due to the downturn in the memory chip market and U.S. export restrictions on equipment to China, having only completed the structural framework.The investment in Dalian Plant 2 is driven by SK Hynix's NAND subsidiary Solidigm, with equipment installation expected to start as early as November this year, and plans to establish a mass production system in the first half of next year. Driven by the expansion of AI data centers, demand for enterprise-level SSDs has surged, with NAND prices rising nearly tenfold compared to a year ago, prompting the restart of investments. SK Hynix will adopt a dual-track strategy: the Dalian factory will use Intel's mature floating gate architecture to produce NAND at the hundred-layer level, while domestic factories like Cheongju M17 will focus on advanced NAND production of over 300 layers, the latter having announced an investment of 19.1 trillion won. Industry insiders expect that the equipment configuration of Dalian Plant 2 will be similar to that of Plant 1, maintaining a monthly production capacity in the range of 40,000 to 60,000 wafers.

hot_img Silicon wafer supply tightens: 12-inch capacity is nearing full load, GlobalWafers signs a 10-year contract with Micron

According to the South Korean media The Elec, GlobalWafers stated during the Q2 earnings call that the production lines for 12-inch, 8-inch, and 6-inch wafers are nearing full capacity, with some advanced 12-inch products experiencing supply constraints due to a surge in demand for AI chips, HBM, and advanced packaging. Shin-Etsu Chemical achieved double-digit growth in 12-inch shipments both year-on-year and quarter-on-quarter in Q2, and Sungrow also believes that customer inventory adjustments are nearing completion. Although SK Siltron is gradually releasing capacity from new production lines, it is still difficult to meet the growth rate of orders.Tight supply is driving changes in long-term contract models, and GlobalWafers signed a 10-year LTA (including advance payment) with Micron last month. Prices in the non-LTA market have begun to rise and are expected to continue to increase in the second half of the year. GlobalWafers stated that it is negotiating with customers to incorporate price adjustment mechanisms into new contracts, and Nexchip also emphasized the need for "broad and meaningful price increases" to support reinvestment. Industry insiders expect that as new factories from Samsung, SK Hynix, and Micron come online, wafer demand will double in the second half of 2027, and supply shortages may further intensify.

hot_img The industry claims that the DRAM capacity for 2027 has been sold out in advance, with HBM accounting for nearly 70% of DRAM capacity

According to DIGITIMES, industry insiders revealed that the three major memory manufacturers have completed the capacity allocation negotiations for the entire year of 2027 in advance, with both DRAM and HBM capacities sold out. In terms of NAND Flash, although it is not as tight as DRAM, it is expected that the capacity will also be fully booked by the end of August 2026. ADATA Chairman Chen Libai confirmed that applications related to HBM and AI servers will account for nearly 70% of DRAM capacity, while the supply of DRAM for PCs and mobile phones will be relatively limited.Industry assessments indicate that Samsung, Micron, and SanDisk's NAND capacity for the entire year of 2027 has also been pre-sold, with Kioxia and SK Hynix expected to confirm by the end of August. SK Group Chairman Chey Tae-won previously stated that the demand for AI semiconductors in 2027 is expected to increase by 60-100% compared to 2026, with storage demand expected to grow by 50-60%, leading to a potential widening of the supply-demand gap and possibly facing "the most severe shortage in history." Industry insiders pointed out that the capacity allocation model is more orderly compared to 2026, but the amount that manufacturers can provide is usually only 60-70% of customer demand, leaving some small and medium buyers still facing the dilemma of having no products to purchase. The price increase of memory may slow down in 2027, but remaining high could become the norm.
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