TSMC's monthly production capacity target for 2 nanometers next year is 110,000 wafers, and for 3 nanometers, it is 210,000 wafers

The supply chain reveals that TSMC has disclosed its expansion targets for 2/3 nanometers for the first time next year. The 2-nanometer production is expected to increase from 90,000 wafers at the end of this year to 110,000 wafers by mid-next year, an increase of 22%; the 3-nanometer production is expected to rise from over 180,000 wafers at the end of this year to 210,000 wafers by mid-next year, an increase of over 16%. TSMC did not comment on market rumors yesterday and emphasized that capacity-related statements are based on the company's announcements.

It is reported that TSMC's monthly capacity for 3 nanometers reached 120,000 to 130,000 wafers at the end of last year and is expected to expand to 180,000 wafers by the end of this year, with a target of over 210,000 wafers by mid-next year. The monthly capacity for 2 nanometers is expected to reach 90,000 wafers by the end of this year. TSMC previously stated that capital expenditures in 2026 will range from $60 billion to $64 billion, with approximately 70% to 80% allocated for advanced processes, and plans to add three 3-nanometer fabs located in Taiwan, Arizona in the United States, and Japan, while converting 5-nanometer equipment in Taiwan to support 3-nanometer capacity.