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Data: The high-position chips of BTC in 2025 have decreased by 41.5%, and the market's maximum supply pressure may be easing

On-chain analyst Murphy stated that currently, all chips bought in BTC in 2025 are basically in a state of loss. Therefore, apart from wallet migrations, the reduction in the scale of 2025 chips likely means that holders are cutting losses and selling. Data shows that as of now, approximately 4.77 million BTC chips bought in 2025 remain, a decrease of 41.5% from the peak in December last year.From the downward trend, this group has experienced two phases: a rapid decrease in chips before February this year, and a significant slowdown in the rate of decline after February, although it still maintains a certain slope. Murphy believes that the 2025 chips may be the largest potential supply side in the current market scale. In contrast, the BTC chips formed in 2024, 2023, and 2022 have basically completed the release of high-level locked positions due to still having unrealized gains, and the slope of the curve is gradually flattening, indicating that the selling pressure from long-term holders is weakening.Historical data shows that during the bottom phases of the past two bear markets, high-level chips have shown a significant decline: at the bottom of the bear market in 2022, the chips bought at high levels in 2021 decreased by about 51%; at the bottom of the bear market in 2018, the chips bought at high levels in 2017 decreased by about 62%. If we refer to historical cycles, Murphy believes that in this bear market bottom phase, the reduction of high-level chips in 2025 may be in the range of 50%-60%, and the current decline of 41.5% indicates that there is still some room for release. However, this judgment has not yet considered the BTC bought by institutional investors such as spot ETFs and MicroStrategy, as this portion of chips is mostly in a long-term locked state, which may reduce the actual market supply pressure.

hot_img MLCC supply is in short supply: customers are raising prices two to three times to secure materials, with delivery times extended to 12-16 months

Driven by strong demand for AI, the MLCC market has seen a surge in price chasing and material grabbing. Industry sources indicate that some customers are willing to pay two to three times the price to secure supplies from major manufacturers like Yageo and Murata, creating a situation where the highest bidder wins. Yageo has admitted that AI-related customers are increasingly looking to lock in capacity in advance to reduce supply risks. Currently, major MLCC manufacturers are fully booked, with capacity nearing full load, and delivery times have extended to 12 to 16 months.In terms of capacity, Yageo expects the utilization rate for standard products this quarter to increase from about 80% in Q2 to over 90%, while special products will maintain a high level above 90%, overall trending towards full capacity. The company is also expanding production, with new capacity set to come online each quarter. Japanese manufacturers are also optimistic, with Murata significantly raising its annual profit forecast, and Taiyo Yuden stating that demand for AI servers has exceeded expectations. Industry insiders point out that large customers typically have a higher priority for capacity allocation, while small and medium-sized customers can only compete for limited supplies by offering higher prices. Yageo has noted that more and more customers wish to secure passive component supplies for the next six months to several years through long-term contracts to mitigate supply chain risks.

hot_img Silicon wafer supply tightens: 12-inch capacity is nearing full load, GlobalWafers signs a 10-year contract with Micron

According to the South Korean media The Elec, GlobalWafers stated during the Q2 earnings call that the production lines for 12-inch, 8-inch, and 6-inch wafers are nearing full capacity, with some advanced 12-inch products experiencing supply constraints due to a surge in demand for AI chips, HBM, and advanced packaging. Shin-Etsu Chemical achieved double-digit growth in 12-inch shipments both year-on-year and quarter-on-quarter in Q2, and Sungrow also believes that customer inventory adjustments are nearing completion. Although SK Siltron is gradually releasing capacity from new production lines, it is still difficult to meet the growth rate of orders.Tight supply is driving changes in long-term contract models, and GlobalWafers signed a 10-year LTA (including advance payment) with Micron last month. Prices in the non-LTA market have begun to rise and are expected to continue to increase in the second half of the year. GlobalWafers stated that it is negotiating with customers to incorporate price adjustment mechanisms into new contracts, and Nexchip also emphasized the need for "broad and meaningful price increases" to support reinvestment. Industry insiders expect that as new factories from Samsung, SK Hynix, and Micron come online, wafer demand will double in the second half of 2027, and supply shortages may further intensify.

hot_img The Dark Side of the Moon launches a $50 billion Pre-IPO round of financing, with the quota "suddenly in short supply" after K3 is released

According to exclusive reports from the Science and Technology Innovation Board Daily, Moonshot AI's G round (Pre-IPO) financing has officially started, with this round's valuation reaching $50 billion. Insiders revealed that the financing amount became "suddenly tight" after the release of the K3 model, and multiple institutions have registered their investment intentions. Participants must complete their payments by August 15, and if they want to directly enter the shareholder register, their management scale must exceed $500 million. The company's previous F round financing (valuation of $35 billion) was just completed last week, raising a total of $3.5 billion. In April of this year, the company's valuation was approximately $18 billion, nearly tripling within three months.Sources say that the core driver behind this round's valuation surge is the release of the K3 model. On July 27, Moonshot AI officially open-sourced the complete model weights of Kimi K3, becoming the world's first large model with 30 trillion parameters to be implemented. Currently, the company's API revenue accounts for more than 70% of total revenue, with ARR achieving several times growth after the K3 release. In response to recent reports stating "the IPO application will be submitted to the Hong Kong Stock Exchange as early as this month," insiders stated that "the information is inaccurate, and the G round financing is still ongoing." As of the time of publication, Moonshot AI has not responded to this news.

Solana plans to advance a supply tightening scheme, with the daily SOL burn amount possibly increasing from $47,000 to $650,000

The Solana community is advancing two governance proposals aimed at reducing the new issuance of SOL and increasing the scale of network fee burns, thereby tightening the token supply. Among them, governance proposal SIMD-0553 suggests introducing a resource consumption-based transaction fee mechanism, charging fees based on the network resources consumed by transactions. It is expected to increase the daily burn of SOL from the current approximately 650 coins (about $47,000) to between 7,500 and 9,000 coins (about $650,000).Another proposal, SIMD-0550, plans to double the rate of decline in SOL's annual inflation, bringing the minimum inflation target of 1.5% forward to 2029 instead of the originally planned 2032. This plan is expected to reduce the issuance of approximately 18.9 million SOL over the next six years, valued at about $1.36 billion at current prices. Currently, both proposals have received support from some validator nodes. As of the latest data, approximately 24.94 million SOL have participated in signaling votes, accounting for 5.8% of the 4.3265 million staked SOL, still about 39.95 million SOL short of the 15% threshold required to enter the formal voting phase. The deadline for supporting signals is August 18.A total of 16 validator nodes have expressed support, with the infrastructure company Helius contributing approximately 16.03 million SOL, accounting for nearly two-thirds of the current support. However, even if SIMD-0553 is successfully implemented, SOL will not immediately enter a deflationary state. Based on a maximum daily burn of 9,000 coins, it is still lower than the current daily new issuance of about 60,000 coins. Therefore, the community is advancing the burn mechanism and the reduction of issuance as linked reforms. If the proposal receives sufficient support from validator nodes, the Solana network will improve its long-term token economic model through a dual mechanism of "reducing new supply + increasing burns."

hot_img TrendForce: DRAM supply tightness will continue until 2027, Nvidia assesses and lowers Rubin Ultra HBM configuration

According to the latest research by TrendForce, the tight supply of DRAM is expected to continue until 2027, and the uncertainty of the HBM4e verification schedule is prompting AI chip manufacturers to consider reducing the HBM configuration of their next-generation products. Starting from Q3 2026, NVIDIA has begun evaluating the HBM solution for Rubin Ultra, expanding from the original 12-Hi HBM4e to alternative options such as 8-Hi HBM4e, 12-Hi HBM4, and 8-Hi HBM4, with the final specifications yet to be determined. Previously, due to the expected supply bottleneck of LPDDR5X lasting until 2027, NVIDIA decided to halve the SOCAMM capacity of the next-generation Vera Rubin Superchip module.TrendForce pointed out that the main reasons for the downgrade of Rubin Ultra from 12-Hi HBM4e include: the overall DRAM shortage in 2027 will limit the allocation of wafer capacity to HBM, and there is still uncertainty regarding the mass production schedule and yield ramp-up of 12-Hi HBM4e. It is expected that the HBM bit shipment volume in 2027 will increase by approximately 50-60% year-on-year, which will still be insufficient to meet the growth in demand. HBM suppliers will maintain pricing power throughout 2027, and HBM prices are expected to rise significantly. The final configuration will depend on the wafer allocation decisions of memory suppliers.
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