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integration

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Flash

Bonk Guy: The Fomo project will complete integration on Arc within a few days

Bonk Guy (Unipcs) posted that Fomo is expected to complete integration within a few days after the launch of the Arc chain, which changes its short-term judgment on Arc. He stated that builders related to Arc have recently contacted early on-chain traders multiple times, indicating their desire to generate early traffic for the new chain through Meme coin activities.Bonk Guy believes that the main opportunities on-chain this cycle are still concentrated in Robinhood, BNB, and Solana, and does not think Arc will become the next mainstream chain. However, he pointed out that Fomo has not yet integrated Hyperliquid, Tron, or TON, all of which have seen Meme assets with market capitalizations exceeding 100 million dollars. Therefore, if Arc connects with Fomo early after its launch, it could bring short-term trading opportunities. He revealed that he has purchased the native token LONG of the main launch platform Long, as well as the top three Meme coins on that platform.His core judgments include: Fomo will integrate Arc, Arc is actively attracting early on-chain traders, and Arc may learn from Robinhood's path of launching ecological growth through Meme activities. Bonk Guy also emphasized that the layout related to Arc is a short-term high-risk experiment and reminded to currently avoid using trading bots like Basedbot and GMGN to prevent significant slippage due to routing to incorrect liquidity pools.

first_img Samsung Electro-Mechanics proposed the direction of AI semiconductor substrate MLC integration

On September 10, Kim Sang-hoon, the head of the packaging division at Samsung Electro-Mechanics, delivered a speech at the KPCA Show International Seminar INSIGHT 2026 held at the Incheon Songdo Conference Center, proposing a multilayer core (MLC) technology direction to address the large-scale and high-multilayer challenges of AI semiconductor packaging substrates.Kim Sang-hoon stated that in the past, the single-layer core (SLC) method, which increased the thickness of a single CCL, led to increased difficulty in processing internal vias and circuits as the core thickened, and the size of the vias became limited. The MLC approach shifts to a combination of CCL and PPG multilayers, or even a mixed structure of two CCLs, which can simultaneously enhance rigidity and wiring freedom, while also allowing for ground or signal wiring to be arranged in the PPG layer. A bonding layer added between the two CCLs can provide more stable support for the substrate, but the process is more complex.Currently, the commonly used bump pitch in mass production is above 90μm, with around 85μm being the turning point for printed fine solder ball processes. The difficulty significantly increases around 80μm, and the 55-45μm range may shift towards metal bumps. Glass cores are another option, offering higher rigidity and lower thermal expansion coefficients, which help reduce warping in large packages, but issues related to fragility and micro-hole plating technology need to be addressed. The substrate must meet signal integrity, power integrity, and mechanical integrity requirements simultaneously, with high-performance packaging substrate layers expected to evolve from about 20 layers at the 90mm level to 120mm and even more than 40 layers.

Gate Europe CEO Dr. Giovanni Cunti: Embedded finance will drive the integration of digital assets into everyday financial life

According to Gate Europe CEO Dr. Giovanni Cunti's latest LinkedIn post, the next phase of digital asset adoption may no longer focus on guiding users to crypto platforms, but rather on integrating digital asset capabilities into the financial services that users are already using. Through embedded finance, scenarios such as payments, commerce, and fund transfers can directly connect to digital asset infrastructure, allowing users to access digital asset-related services without changing their existing financial service usage.Dr. Giovanni Cunti also pointed out that this trend is reshaping the competitive logic of the digital asset industry. Liquidity and product capabilities will still be important foundations, but whether payment channels, asset custody, risk management, and compliance systems can achieve synergy in different markets and regulatory environments will become increasingly critical. Europe has significant advantages in this development process, as MiCA is gradually establishing a more unified regulatory framework for digital assets, and the continuous evolution of payment infrastructure is creating new opportunities for compliant digital asset companies to collaborate deeply with the traditional financial system.For Gate Europe, the integration of digital assets and payment systems is becoming an important direction for business development. Relying on the compliance foundation established by the dual licensing system of MiCA and payment institutions (PI), Gate Europe will further promote the connection between digital assets and payment services, as well as a broader financial ecosystem. As digital assets gradually integrate into daily financial activities, they are expected to evolve from independent financial products into a core component of a new generation of financial infrastructure that is more open, interconnected, and programmable.
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