factory

The GoPlus security team disclosed that a high-risk fraudulent Meme factory was recently discovered on the Robinhood Chain, with a transaction volume exceeding 9 million dollars in the past 30 days, involving hundreds of fraudulent Memes. The asset aggregation address is 0x8c3Bad30cc7563A2D0357F49509FFd063666bb00. As of September 28, 2026, the address balance is approximately 56.0635 ETH, equivalent to about 148,000 dollars; the address has a total of about 1,385 transactions, with the latest 400 transactions generating approximately 1,728.02 ETH in income and transferring out approximately 1,861.12 ETH; the two-way transaction volume is about 3,589.14 ETH, equivalent to about 9.49 million dollars.Direct evidence of "authorizing or selling tokens ---> liquidating ETH ---> transferring to the same aggregation address" was found in the high-risk associated Memes. The amount is the gross amount transferred into the aggregation system from the same project batch and does not represent net profit. The fraudulent Meme factory model mainly includes "new accounts shipping out ---> layered aggregation ---> fund recycling: 1. Creating Tokens based on industry hotspots; 2. Allocating Tokens to a large number of new EOAs with only 4 to 11 transactions; 3. Selling in segments through PonsV2Helper / UniversalRouter; 4. Emptying ETH to local aggregators or the main aggregation address (0x8c3bad); 5. Providing funds for the next round of projects, new wallets, and trading operations. The key to this fraud model is: 1. Using a large number of new wallets to hide the actual concentration of chips; 2. Segmentally selling by these wallets to create the illusion of multiple independent traders; 3. After the shipment is completed, funds flow into the same aggregation system; 4. Reinvesting the profits from old projects into the next round.On-chain researcher Wazz recently disclosed that a suspected continuous Rug gang initiated at least 53 Robinhood Chain Memes within about two months and extracted approximately 18.43 million dollars from them. Their main tactic is to control most of the token supply using 70 to 200 wallets, then reinvest the profits from the previous round into the next round. This case is similar to the fraudulent model in this case, but there is currently no evidence to indicate that it is the same gang.

Taiwan Semiconductor Manufacturing Company (TSMC) has fully started production at its first wafer fab in Singapore, driven by demand for AI infrastructure.The factory is a joint venture with NXP and began trial production in June, achieving a yield rate of 99%. Mass production is planned for early 2027. TSMC holds approximately 19% of the shares.

According to a report by South Korea's Small and Medium Business News on September 28, industry insiders stated that SK Hynix has initiated the foundational engineering required for establishing a semiconductor factory in the Tohoku region of Japan. One insider mentioned that it is still unclear whether the project will be an independent factory or a joint venture with Kioxia, but local groundwork is underway, and SK Hynix has also requested domestic component suppliers in South Korea to expand their supply.The report noted that as of a month ago, SK Hynix's stance on building a memory semiconductor factory in Japan was still "under research," and they stated that "there are no specific decisions." In response to this news, SK Hynix indicated that the Japanese memory semiconductor factory is still in the research phase, with no further advancements at this time.The report also mentioned that SK Group Chairman Chey Tae-won stated in August this year that they are studying the establishment of a joint venture memory semiconductor factory in Japan, with the Tohoku region subsequently seen as a strong candidate. The Tohoku region of Japan and Iwate Prefecture have gathered semiconductor and material component companies such as Kioxia's Kitakami factory, Japan Semiconductor, Ancor Technology, Denso, and Tokyo Electron.

According to the Economic Daily, the shipment of optical CPO related equipment for joint packaging is increasing. Suppliers such as ZhiDe, GaoMingTie, and DongYouDa have stated that orders from Europe, America, and Asia are flooding in, with order visibility extending to the second quarter of next year, and they are simultaneously starting factory expansions. Customers' demand for high-precision motion platforms and automated optical coupling equipment is increasing, with a noticeable rise in clients from Southeast Asia, including Singapore and Malaysia, in addition to major manufacturers in Europe and America.ZhiDe stated that after receiving thousands of orders for international CPO equipment, they have recently made new gains and are negotiating cooperation on CPO alignment modules with domestic and major manufacturers in Europe and America, with overall orders initially looking at a thousand units. The company is expanding production in the Shugu Garden and Nanke Park in response to demand, expecting to launch new capacity in the fourth quarter and continue to ramp up production next year.GaoMingTie has been certified by the world's top ten optical communication brands and has secured orders for 800G and 1.6T optical module coupling alignment modules, with optical communication product revenue accounting for 79% in the first half of the year. The company has acquired about 60% equity in an optical and medical factory in Taichung, and after establishing a production assembly line, the estimated capacity can be expanded by more than double, with the Dongguan subsidiary expected to ramp up production after mid-next year. DongYouDa is collaborating with the Japanese company Junhe on CPO optical coupling equipment, with order visibility extending to the second quarter of next year, and has already initiated plans to establish factories in Vietnam, India, and Mexico, increasing capacity utilization from 70% by the end of 2025 to 80%.

Samsung Electronics has started prototype production of AI5 chips for Tesla at its foundry in Taylor, Texas. Due to the surge in demand for AI chips, Samsung has accelerated prototype output for yield verification, planning to complete mass production validation by the end of this year and to supply fully next year.

The Tesla team arrived in Ningbo on September 16 and launched a new round of mass production audit for the robotics business on September 17. This audit aims to review the exclusivity and consistency of the mass production of the Optimus robot, with plans to roll out approximately 50,000 Optimus robots by 2026.

The enterprise-level self-improvement software development company Factory announced the completion of a $200 million financing round, with a valuation reaching $5 billion; the company's total financing has exceeded $400 million, more than doubling its valuation from $1.5 billion in April this year.This round of funding will be used to accelerate research and development, product expansion, and global market development. Factory stated that institutions such as Blackstone, Khosla Ventures, Sequoia Capital, Insight Partners, Evantic Capital, Sound Ventures, New Enterprise Associates (NEA), Mantis VC, and Clearlake, as well as individuals like Nico Rosberg, Brad Gerstner, and Marc Benioff, support its development. Factory claims that hundreds of thousands of developers are using its products, including teams from NVIDIA, Blackstone, Royal Bank of Canada (RBC), Palo Alto Networks, and Adobe.

According to Electronic News on September 15, China's largest NAND flash memory manufacturer Yangtze Memory Technologies Corp (YMTC) has begun the connection work for production equipment at its third factory (FAB3) in Wuhan, with initial production expected to gradually become visible by the end of the year.China Electronics System Engineering Second Construction Co., Ltd. recently selected a construction company for the "Gas Segment 3" of the "Wuhan YMTC FAB3 Secondary Piping Segment B General Contracting Project." This project will connect the factory's existing gas, water, and other utility supply networks to various production equipment. The bidding conditions require experience in construction projects related to YMTC or Changxin Memory Technologies, or equivalent scale 12-inch semiconductor factories.YMTC's Wuhan Factory 3 is expected to begin initial production by the end of this year, with a capacity of approximately 100,000 12-inch wafers per month when fully operational. According to Counterpoint Research, YMTC's global NAND bit shipment share in the second quarter of this year reached 14%, rising to third in the world, with Samsung Electronics at 25% in first place and SK Hynix at 22% in second.

China's largest DRAM manufacturer Changxin Storage (CXMT) has recently launched a bidding for equipment from partners for its new factory in Shanghai and is advancing capacity expansion in multiple locations. CXMT is currently mass-producing DRAM in Hefei Phase II and Beijing Phase I, with an estimated capacity of about 200,000 wafers per month, which may exceed 300,000 wafers per month by the end of the year.CXMT plans to open the new factory in Shanghai in the fourth quarter of this year, and the related equipment bidding has already started. Semiconductor equipment industry insiders say that the factory is planned to be expanded in two phases, with capacity significantly exceeding 100,000 wafers per month. Subsequently, there are plans to open a new factory in Hefei in the first half of next year and the earliest new factory in Beijing in the second half of next year, with another new factory in Hefei opening in the first half of the year after next.Equipment industry insiders say that CXMT has communicated with multiple parties regarding the timing of building factories in various locations. If all plans are realized, CXMT could add at least 70,000 to 80,000 wafers of capacity per month each year from this year until 2028, with a long-term goal of exceeding 600,000 wafers per month. Samsung Electronics and SK Hynix's DRAM capacities are estimated at about 700,000 wafers and 600,000 wafers per month, respectively.

Cisco announced a collaboration with Palantir and NVIDIA to establish a secure artificial intelligence factory to streamline the deployment of artificial intelligence.

The Central Science Management Bureau confirmed on the 9th that TSMC's Central Science Phase II 1.4 nanometer factory expansion is fully accelerating. The first P1 factory has completed its steel structure and is expected to begin trial production in April next year, with mass production anticipated in the second half of next year, ahead of the originally scheduled mass production in 2028. TSMC has applied to the Central Science Management Bureau to set up two temporary offices at the site, which are expected to be completed in April next year, with the first batch of over 5,400 operational and outsourced personnel moving in.The advanced process new factory for TSMC's Central Science Phase II park broke ground last October, planning to build four 1.4 nanometer factories, with nearly 2,000 workers working day and night. The P1 factory is currently undergoing floor and exterior wall construction, with the factory building expected to be completed early next year. The P2 factory has begun basic construction and is scheduled to be completed in October next year, with both factories expected to start mass production successively next year. The P3 factory has obtained a construction permit, while the P4 factory is in the process of applying for a construction permit, planning to be built with a six-month gap. P3 is expected to be completed in the second quarter of 2028, and P4 is scheduled for completion in the fourth quarter of the same year. After the P2 factory is completed in the second half of next year, an additional 1,000 operational personnel will be added, with the total number of employees expected to be between 9,000 and 10,000 when all four new factories in Phase II are completed and put into production.

Cloverleaf plans to build a gigawatt-level artificial intelligence factory in the United States and will deploy the NVIDIA DSX platform at the AI site.

According to a report by Infomax under the Korea Herald, SK Hynix is advancing its plan to build a semiconductor factory in Miyagi Prefecture, Japan, with an investment scale of hundreds of trillions of Korean won. SK Group Chairman Choi Tae-won recently visited the area personally. Miyagi Prefecture is one of the three major semiconductor industry bases supported by the Japanese government.The report states that this factory will be an overseas production base added by SK Hynix outside of its clusters in Yongin, South Korea, and Hunan, China, aimed at meeting the ongoing tight global supply and demand situation for memory. If the plan materializes, SK Hynix will become the third foreign semiconductor company to establish a factory in Japan, following Micron and TSMC. The report points out that due to ongoing pressure from the United States for South Korean companies to increase investments in the U.S., this investment in Japan may further intensify U.S. pressure, while the Japanese government's subsidy policy is also an important consideration. SK Hynix has not officially responded to this news. Previously, on August 20, SK Hynix announced a 40 trillion won share buyback cancellation plan.

According to ZDNet Korea, Samsung Electronics is accelerating the expansion of its advanced wafer foundry capacity in the United States. The company plans to start the second phase of construction at the Taylor wafer plant in Texas by the end of this year, aiming for mass production by 2030, and has requested major equipment partners to obtain SEMI certification in advance for subsequent equipment import and export. SEMI certification is a standard for assessing the safety of semiconductor equipment and is usually a necessary procedure before equipment leaves the country.The Taylor wafer plant is responsible for Samsung's most advanced foundry mass production tasks. The first phase is currently undergoing equipment entry and installation, with a target to start production by the end of this year, focusing on a 2-nanometer mass production process, with Tesla seen as a core customer. Samsung stated in last month's second-quarter earnings call that to respond promptly to the growing customer demand, the second phase of Taylor will commence by the end of this year. Industry insiders say that although the specific specifications for the second phase have not yet been finalized, Samsung's foundry business has already pushed forward relevant preparations in advance.Previously, Samsung had postponed the investment in the first phase of Taylor multiple times due to insufficient customers and a sluggish market, until Tesla signed a foundry agreement worth approximately 22.76 trillion won in the third quarter of last year, which accelerated construction. The actual pace of mass production in the second phase will still depend on the expansion of supply to Tesla and the progress of new major customers. Additionally, there are reports that Samsung E&A is considering dispatching dozens of construction personnel locally.

According to the Dong-A Ilbo, Samsung Electronics plans to expand the core project of the P5 1·2 factory (Fab 5·6) in Pyeongtaek, Gyeonggi Province, from a dual-layer wafer factory to a three-layer wafer factory to respond to the global artificial intelligence semiconductor and memory supercycle and maximize production capacity. Samsung Electronics has recently submitted a plan to change the industrial park, proposing to increase the floor area ratio from 350% to a maximum of 490%. This change must be reviewed by the Gyeonggi Province governor and approved by the Ministry of Land, Infrastructure and Transport's industrial site policy review committee before it can be finalized.The Pyeongtaek P5 1·2 factory is the largest semiconductor factory in the world under a single standard, which began construction in 2022 and aims to be completed by 2030. It will produce high bandwidth memory (HBM), high-end DRAM, next-generation V-NAND, and advanced foundry products. The currently operational Pyeongtaek P4 uses a dual-layer structure with four clean rooms in a single building; if the change is approved, P5 will be configured with up to six clean rooms, and the number of clean rooms and production capacity is expected to increase by about 1.5 times. SK Hynix also plans to use a three-layer structure for all newly constructed wafer factories in the Yongin semiconductor cluster.Market research firm Counterpoint Research expects the global memory market size to increase from approximately 360 trillion won last year to 1,500 trillion won this year and 2,100 trillion won next year. In the context of increasingly difficult access to electricity, water, and land, increasing the floor area ratio to build three-layer wafer factories has become an important path to overcome the physical limitations of limited space and rely on the existing semiconductor industry ecosystem.

According to the Economic Daily, TSMC's advanced packaging CoWoS capacity is in short supply, and it has been reported that some backend orders have overflowed to Intel's factory in Malaysia, where Intel is assisting with packaging using part of its capacity to serve common major customers, breaking the past ecosystem competition norms. TSMC Chairman Wei Zhejia previously stated at a conference call that TSMC focuses on advanced packaging in the frontend and welcomes "more manufacturers to supply capacity" for the shortage in the backend, providing flexible alternatives for common customers.The report points out that the bottleneck in advanced packaging capacity mainly lies in the backend ramp-up speed being lower than that of the frontend process, and the widening gap in CoWoS capacity has forced orders to overflow. SemiAnalysis Chipbook data shows that approximately $1.3 billion worth of HBM has been shipped to Malaysia, and industry analysis indicates that Intel's local factory should already have the capability for large-scale HBM integration. Intel CEO Pat Gelsinger stated that the EMIB-T technology is ensuring reliable yield, and in the context of insufficient CoWoS capacity, "Intel is in a unique position to provide support." Companies with overlapping supply chains such as Unimicron, ASE Technology Holding, and Jiadeng are expected to benefit simultaneously, with Unimicron's stock price rising over 7% on that day. Intel's EMIB-T related applications are targeted for mass production by 2027.

SK Hynix has restarted the construction of its second NAND flash memory factory in Dalian, expecting to increase the monthly production capacity in the region by about 50%. The new production line is designed for a monthly capacity of approximately 50,000 wafers, combined with the existing Dalian Plant 1's monthly capacity of 100,000 wafers, bringing SK Hynix's total NAND production capacity in China to about 150,000 wafers per month. The factory began construction four years ago but was paused due to the downturn in the memory chip market and U.S. export restrictions on equipment to China, having only completed the structural framework.The investment in Dalian Plant 2 is driven by SK Hynix's NAND subsidiary Solidigm, with equipment installation expected to start as early as November this year, and plans to establish a mass production system in the first half of next year. Driven by the expansion of AI data centers, demand for enterprise-level SSDs has surged, with NAND prices rising nearly tenfold compared to a year ago, prompting the restart of investments. SK Hynix will adopt a dual-track strategy: the Dalian factory will use Intel's mature floating gate architecture to produce NAND at the hundred-layer level, while domestic factories like Cheongju M17 will focus on advanced NAND production of over 300 layers, the latter having announced an investment of 19.1 trillion won. Industry insiders expect that the equipment configuration of Dalian Plant 2 will be similar to that of Plant 1, maintaining a monthly production capacity in the range of 40,000 to 60,000 wafers.

SK Hynix plans to invest 35.2 trillion won in the second phase of chip factory construction in Yongin, South Korea.

SpaceX plans to build its own power facilities for the large semiconductor manufacturing plant Terafab being developed in Texas. Riley Trettel, who is responsible for energy and data center development, stated that a gas power plant and a large battery array will be constructed to store energy to meet the surging power demand. Elon Musk's companies have long favored vertical integration, and Tesla is also participating in the energy market in Texas.