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hot_img SK Hynix will expand its NAND production capacity in Dalian by about 50%, with the second factory in Dalian expected to start production in the first half of next year

SK Hynix has restarted the construction of its second NAND flash memory factory in Dalian, expecting to increase the monthly production capacity in the region by about 50%. The new production line is designed for a monthly capacity of approximately 50,000 wafers, combined with the existing Dalian Plant 1's monthly capacity of 100,000 wafers, bringing SK Hynix's total NAND production capacity in China to about 150,000 wafers per month. The factory began construction four years ago but was paused due to the downturn in the memory chip market and U.S. export restrictions on equipment to China, having only completed the structural framework.The investment in Dalian Plant 2 is driven by SK Hynix's NAND subsidiary Solidigm, with equipment installation expected to start as early as November this year, and plans to establish a mass production system in the first half of next year. Driven by the expansion of AI data centers, demand for enterprise-level SSDs has surged, with NAND prices rising nearly tenfold compared to a year ago, prompting the restart of investments. SK Hynix will adopt a dual-track strategy: the Dalian factory will use Intel's mature floating gate architecture to produce NAND at the hundred-layer level, while domestic factories like Cheongju M17 will focus on advanced NAND production of over 300 layers, the latter having announced an investment of 19.1 trillion won. Industry insiders expect that the equipment configuration of Dalian Plant 2 will be similar to that of Plant 1, maintaining a monthly production capacity in the range of 40,000 to 60,000 wafers.

Changxin Memory is considering building a second DRAM wafer factory in Beijing and is in talks for financing support

According to Reuters, informed sources say that Changxin Storage is considering building a second 12-inch DRAM wafer fab in Beijing's Yizhuang and is negotiating financing with the Beijing Economic and Technological Development Zone and several state-owned technology companies. The company is seeking at least 60 million yuan (approximately 8.9 million USD) in support, but negotiations are still in the early stages, and the scale and structure of the financing may be adjusted.The proposed factory will be located at the site of Changxin Storage's existing DRAM wafer fab in Beijing. The planned production capacity and total investment for the project have not yet been determined, while building a fab capable of producing advanced DRAM typically requires over 10 billion USD. Currently, Changxin Storage operates two 12-inch DRAM wafer fabs in Hefei and one in Beijing, each with a monthly production capacity of about 100,000 wafers. Changxin Storage is also building new factories in Shanghai and Hefei, and once the related projects are fully operational, the company's monthly production capacity could double to over 600,000 wafers.This expansion comes as demand for storage chips is driven by AI infrastructure, data centers, and consumer electronics entering an upward cycle. The company completed an 8.6 billion USD IPO last month, marking the largest fundraising for a semiconductor company listed in mainland China, and its stock price has risen by 13% since going public. Changxin Storage is currently the fourth largest DRAM manufacturer in the world, but Samsung Electronics, SK Hynix, and Micron together still account for nearly 90% of the global market share in the first quarter. Beijing and Shanghai are also providing funding and other support to Changxin Storage to gain economic and strategic benefits from its expansion.
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