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first_img TSMC temporarily uses micro-bump packaging for HBM and requires the development of a 5μm solution

According to sources in the materials industry, on September 2, TSMC is expected to continue using traditional micro-bump technology rather than hybrid bonding in the short term for connecting high-bandwidth memory (HBM) with AI accelerators in advanced packaging. Considering the development cycle of related materials, finer pitch micro-bumps are expected to be used until the later stages of HBM4 and the early stages of HBM5. TSMC has requested its materials and equipment partners to develop bonding and underfill solutions for approximately 5-micron bumps, with suppliers from South Korea and Japan beginning development, and mass production of 5μm bumps expected to start in the second half of 2028.Currently, the bump height of the third-generation extended HBM, namely HBM3E, is about 15-25μm, while HBM4 is close to about 10μm. Japanese material suppliers have previously stated that it is difficult to guarantee quality below 15μm. The reduction and refinement of bumps are due to the height limitations of HBM cubes and the demand for higher interconnection density. JEDEC specifies that the maximum height for HBM stacks is 775μm. In TSMC's advanced CoWoS packaging, the HBM stacks assembled by GPU and memory suppliers are mounted onto the silicon interposer via micro-bumps, with the 16-layer DRAM chip stacks completed within HBM packaging by SK hynix and Samsung Electronics.The first and second generations of HBM used larger solder bumps, while micro-bumps became mainstream around the HBM3 generation. SK hynix uses the MR-MUF process, while Samsung Electronics uses TC-NCF. Hybrid bonding allows for thinner and denser interconnections through direct bonding of copper pads; TSMC has utilized this on its SoIC platform for logic chip stacking, but HBM still connects to the interposer using micro-bumps.

Bitget launches institutional-grade CFD liquidity solutions, supporting multi-tier depth aggregation and 100% STP execution

Bitget officially launches an institutional-level CFD liquidity solution aimed at quantitative teams, proprietary trading firms, funds, brokers, and high-net-worth professional traders, supporting high-frequency quantitative trading, arbitrage, and automated trading scenarios such as EA. As the demand for execution efficiency, liquidity, and low latency continues to rise among professional trading institutions, this solution aims to provide a more stable and efficient execution environment for large-scale, high-frequency trading.In terms of execution and liquidity, Bitget adopts a 100% STP (Straight Through Processing) model, routing orders directly to external liquidity pools and aggregating multi-tier market depth from global tier-one banks and non-bank market makers to reduce slippage and market impact during the execution of large orders. Meanwhile, trading servers are deployed in core financial data centers such as London LD4 and Tokyo TY3, supporting sub-millisecond order matching through dedicated lines and fiber connections, and providing FIX API to facilitate institutional clients' access to existing trading systems, bridging tools, and liquidity aggregation platforms.In terms of fund management, client assets and platform operating funds are segregated, and asset management transparency is enhanced through independent custody accounts, compliance reviews, and third-party auditing mechanisms. The launch of this institutional-level liquidity solution further improves Bitget's CFD backend trading infrastructure, complementing existing retail products and covering a multi-layer trading demand from ordinary traders to professional institutions.
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