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first_img CPO equipment supplier orders are visible until the second quarter of next year, Zhidé and Gaoming Iron are starting factory expansions

According to the Economic Daily, the shipment of optical CPO related equipment for joint packaging is increasing. Suppliers such as ZhiDe, GaoMingTie, and DongYouDa have stated that orders from Europe, America, and Asia are flooding in, with order visibility extending to the second quarter of next year, and they are simultaneously starting factory expansions. Customers' demand for high-precision motion platforms and automated optical coupling equipment is increasing, with a noticeable rise in clients from Southeast Asia, including Singapore and Malaysia, in addition to major manufacturers in Europe and America.ZhiDe stated that after receiving thousands of orders for international CPO equipment, they have recently made new gains and are negotiating cooperation on CPO alignment modules with domestic and major manufacturers in Europe and America, with overall orders initially looking at a thousand units. The company is expanding production in the Shugu Garden and Nanke Park in response to demand, expecting to launch new capacity in the fourth quarter and continue to ramp up production next year.GaoMingTie has been certified by the world's top ten optical communication brands and has secured orders for 800G and 1.6T optical module coupling alignment modules, with optical communication product revenue accounting for 79% in the first half of the year. The company has acquired about 60% equity in an optical and medical factory in Taichung, and after establishing a production assembly line, the estimated capacity can be expanded by more than double, with the Dongguan subsidiary expected to ramp up production after mid-next year. DongYouDa is collaborating with the Japanese company Junhe on CPO optical coupling equipment, with order visibility extending to the second quarter of next year, and has already initiated plans to establish factories in Vietnam, India, and Mexico, increasing capacity utilization from 70% by the end of 2025 to 80%.

first_img TSMC accelerates its layout in CPO, and the industry is optimistic about forming a new Moore's Law

According to Taiwan's "Commercial Times" report on September 14, as the computing power of GPUs and ASICs continues to rise, traditional copper interconnects are gradually approaching the limits of power consumption and signal transmission. TSMC is accelerating its layout for co-packaged optics (CPO). The industry is optimistic that if CPO bandwidth continues to double every two years, it may form the "CPO Moore's Law" of the AI era. Industry analysis indicates that the upgrade of CPO bandwidth mainly has three paths: including increasing single-channel speed from 200G to over 400G, expanding the number of optical channels from 16 to 32, 64 or more, and introducing wavelength division multiplexing (WDM). By 2040, the theoretical value could reach about 128 times the current level, with long-term potential for development towards hundreds of T based on the current level of about 3.2T.TSMC's role in optical interconnects has extended from wafer foundry to system integration, gradually integrating computing, HBM memory, and high-speed I/O from 3DFabric, CoWoS, SoIC to silicon photonics and CPO. When high-speed electrical signals exceed 200G, signal attenuation increases after passing through longer copper paths such as ABF substrates, PCBs, and connectors, leading the industry to develop shorter copper paths and longer optical paths. In terms of packaging architecture, the optical engine is currently laid out on the substrate, and the next step is expected to place CPO in the intermediary layer, with future possibilities of using SoIC technology to achieve 3D vertical integration of photonic integrated circuits (PIC) and ASICs. Industry players indicate that CPO still needs to overcome challenges in packaging, optical coupling, and testing before mass production can be achieved.
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