Lei Jun announces the release of the Xuanjie O3, O100, and D100 chips
Lei Jun announced that Xiaomi's new generation of the Xuanjie family of chips, Xuanjie O3, Xuanjie O100, and Xuanjie D100, have all completed back-plate verification. Xuanjie O3 is an AI flagship SoC aimed at the highest-end products and will debut on the Xiaomi 18 Fold; Xuanjie O100 is a 1.22TB/s high-bandwidth AI acceleration chip, and Xuanjie D100 is the first domestic 3nm intelligent driving high-performance AI chip, with the latter two set to officially launch next year. The three chips cover the AI computing power needs of Xiaomi's entire ecosystem of people, vehicles, and homes.Xuanjie O3 uses a 3nm process, has an area of 133mm², and a transistor count of 24 billion, which is a 26% increase over the previous generation, with an AnTuTu extreme score reaching 5.22 million. The CPU features a ten-core all-large-core design, with a maximum frequency of 4.35GHz, Geekbench single-core score of 3945, and multi-core score exceeding 15000; the GPU has 16 cores and supports ray tracing, with significant improvements in multiple graphics performance metrics and a 64% reduction in power consumption compared to the previous generation. This chip is the industry's first to support LPDDR6, with an NPU tensor computing power of 200TOPS, and is specifically optimized for large language model inference.Xuanjie O100 is the world's first 6nm 3D wafer-level stacked AI acceleration chip, utilizing wafer-on-wafer packaging and hybrid bonding, with two layers of AI-specific high-speed DRAM and one layer of high-performance NPU stacked vertically, achieving a bandwidth of 1.22TB/s. Together with O3, it can achieve a maximum local AI inference speed of 330 Tokens/s. Xiaomi has restarted its large chip research and development for over five years, with a cumulative investment exceeding 21 billion yuan and a chip team of nearly 3000 people.
